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IDC - 4 Wall (Shrouded) FHC

 Available in Through Hole or Surface Mount versions
 PLCC Through Hole features include  visual and mechanical polarization  for proper chip orientation, closed  bottom frame to eliminate bridging  and solder wicking and corner standoff  to allow easy removal of flux residue
 PLCC surface mount features include  ultra low profile in critical height  applications, visual and mechanical  polarization for proper chip orientation  open bottom frame for inspection or  repair of solder joints without removing  socket. An optional locating peg available
 Insulators are made of high temperature  PPS, glass reinforced UL94V-0
 PLCC sockets accept plastic leadeded  chip carriers and conform to EIA/JEDEC  standards in Registration MO-047  AA through AH
 Convert the 0.050" chip centerlines  to through-board or surface mount  leads on a .100" centerline grid
 Contact design allows a wide  variation in tolerances while providing  a uniform retention force
 Designed for automatic insertion

 SERIES: PLCC (THROUGH HOLE), PLCCSM (SURFACE MOUNT)